The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2024

Filed:

Jan. 17, 2019
Applicant:

Sharp Kabushiki Kaisha, Sakai, JP;

Inventors:

Takao Saitoh, Sakai, JP;

Masahiko Miwa, Sakai, JP;

Yohsuke Kanzaki, Sakai, JP;

Masaki Yamanaka, Sakai, JP;

Yi Sun, Sakai, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/52 (2006.01); H01L 27/32 (2006.01); H01L 51/56 (2006.01); H10K 50/844 (2023.01); H10K 59/131 (2023.01); H10K 71/00 (2023.01); H10K 59/12 (2023.01); H10K 77/10 (2023.01); H10K 102/00 (2023.01);
U.S. Cl.
CPC ...
H10K 50/844 (2023.02); H10K 59/131 (2023.02); H10K 71/00 (2023.02); H10K 59/1201 (2023.02); H10K 77/111 (2023.02); H10K 2102/311 (2023.02);
Abstract

A first resin layer is provided to fill a slit formed in at least one inorganic insulating film included in a TFT layer, and extending in a longitudinal direction of a fold portion. A plurality of first routed wires are provided above the first resin layer, and extending in parallel with one another and intersecting with the longitudinal direction of the fold portion. A first protective layer is formed between, and in contact with, the first resin layer and the first routed wires, and provided to at least partially coincide with each of the first routed wires.


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