The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2024
Filed:
Aug. 18, 2020
Nederlandse Organisatie Voor Toegepast-natuurwetenschappelijk Onderzoek Tno, 's-Gravenhage, NL;
Margaretha Maria De Kok, Eindhoven, NL;
Gerardus Titus Van Heck, Eindhoven, NL;
Jeroen Franciscus Marinus Schram, Waalre, NL;
Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO, 's-Gravenhage, NL;
Abstract
An electronic component () is connected to a conductive track () on a flexible substrate (). A connection layer () of a composition comprising a thermoplastic material (TPM) is provided on the conductive track (). The connection layer () has at least one cutout () aligned to overlap the conductive track (). A thermosetting material (TSM) in liquid state is used to fill the cutout (). The electronic component () is provided on top of the connection layer (). By applying heat, a temperature of the connection layer () is raised to above a softening temperature of the thermoplastic material (TPM). Pressure is applied to form a mechanical connection. By the application of heat (H) a temperature of the thermosetting material (TSM) is raised above its thermosetting temperature for solidifying the thermosetting material (TSM) and forming an electrical connection (E).