The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2024

Filed:

Aug. 17, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventor:

Eunseok Hong, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); G06F 1/16 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); G06F 1/1684 (2013.01); H05K 1/115 (2013.01); H05K 1/144 (2013.01); H05K 1/185 (2013.01); H05K 2201/096 (2013.01); H05K 2201/10378 (2013.01);
Abstract

An example electronic device includes a housing, a first board and a second board disposed in an interior of the housing and disposed to face each other in a first direction, an interposer extending to surround an interior space between the first board and the second board, a first conductive layer disposed to face the first board and including a first conductive area, a second conductive layer disposed to face the second board and including a second conductive area, an insulation layer disposed between the first conductive layer and the second conductive layer, a first insulation part disposed between the first conductive layer and the first board and covering the first conductive area, a second insulation part disposed between the second conductive layer and the second board and covering the second conductive area, a first plating area extending from the first conductive layer to the second conductive layer, on a first side surface of the insulation layer, and a second plating area extending from the first conductive layer to the second conductive layer, on a second side surface of the insulation layer.


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