The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2024
Filed:
Nov. 22, 2018
Mitsubishi Electric Corporation, Tokyo, JP;
Yutaka Yoneda, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A sensor module comprising: A sensor chip () is provided on an upper surface of the substrate (). A lens () is provided above the sensor chip () such that a light receiving unit of the sensor chip () is positioned in a projection area. A lens cap () includes a cap body () surrounding the sensor chip () to hold the lens (), and a cap edge part () protruding outward from a lower end part of the cap body (). An ultraviolet-curing type bonding agent () bonds the upper surface of the substrate () and a lower surface of the lens cap (). A cutout () is provided on an outer side surface of the cap edge part (). The bonding agent () enters in the cutout ().