The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2024
Filed:
Jan. 09, 2023
Rayprus Technology (Foshan) Co., Ltd., Foshan, CN;
Kun Li, Jincheng, CN;
Shin-Wen Chen, New Taipei, TW;
Bo-Ying Zhu, New Taipei, TW;
Yu-Shuai Li, Shenzhen, CN;
Jian-Chao Song, Jincheng, CN;
Wu-Tong Wang, Jincheng, CN;
Rayprus Technology (Foshan) Co., Ltd., Foshan, CN;
Abstract
A photosensitive assembly includes a circuit board. The circuit board has a first surface, a second surface opposite to the first surface, and a first through hole extending through the first surface and the second surface. A photosensitive chip is disposed on the second surface. The photosensitive chip has a photosensitive area and a non-photosensitive area connected to the photosensitive area, the non-photosensitive area is electrically connected to one side of the second surface, and the photosensitive area is exposed from the first through hole. A reinforcing plate is disposed on the first surface. A thermal conductive layer is disposed on the photosensitive chip, and the thermal conductive layer includes a silica gel or a metal.