The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2024
Filed:
Dec. 26, 2019
Applicant:
Kyocera Corporation, Kyoto, JP;
Inventors:
Kentaro Murakawa, Kyoto, JP;
Katsuaki Masaki, Kyoto, JP;
Assignee:
KYOCERA Corporation, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/40 (2010.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 33/40 (2013.01); H05K 3/34 (2013.01); H01L 2933/0033 (2013.01);
Abstract
The present disclosure relates to an electronic component joining method and a joined structure. A solder layer made of a gold-tin alloy including 20 mass % or greater of tin is formed on a light-emitting element side, and a layer including gold as a main component is formed, as a joining layer for joining to the solder layer, on a submount side. The solder layer and the joining layer are heated at a temperature below the melting point of the gold-tin alloy of the solder layer to join the light-emitting element and the submount.