The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2024

Filed:

Apr. 19, 2021
Applicant:

Palo Alto Research Center Incorporated, Palo Alto, CA (US);

Inventors:

Evgeniy Bart, Santa Clara, CA (US);

Yunda Wang, Milpitas, CA (US);

Matthew Shreve, Mountain View, CA (US);

Assignee:

Xerox Corporation, Norwalk, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 21/683 (2006.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/0095 (2013.01); H01L 21/6835 (2013.01); H01L 25/0753 (2013.01); H01L 33/62 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68368 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A method utilizes a target substrate has an array of chips on a carrier with a plurality of vacancies and a plurality of donor coupons are incompletely filled with functional chips. A bounding box is defined that encompasses the vacancies on the target substrate. Outcomes are simulated by overlapping a representation of the bounding box over a representation of each of a plurality of donor coupons at a plurality of translational offsets on a substrate plane to determine matches. An optimal one of the outcomes is found at a selected one or more of the donor coupons corresponding one or more offsets. A parallel transfer of the matching functional chips fills the vacancies on the target substrate using the one or more selected donor coupons and corresponding one or more offsets.


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