The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2024
Filed:
Jul. 15, 2021
Ningbo Sunny Opotech Co., Ltd., Zhejiang, CN;
Mingzhu Wang, Zhejiang, CN;
Takehiko Tanaka, Nara, JP;
Nan Guo, Zhejiang, CN;
Zhenyu Chen, Zhejiang, CN;
Bojie Zhao, Zhejiang, CN;
NINGBO SUNNY OPOTECH CO., LTD., Zhejiang, CN;
Abstract
Provided are a camera module, a molding photosensitive assembly and manufacturing method thereof, and an electronic device. The molding photosensitive assembly comprises a molding portion, at least one photosensitive chip and at least one circuit board, wherein the photosensitive chip is provided on the circuit board, the molding portion comprises a molding portion main body, the molding portion main body is made of a transparent material, and the molding portion main body, the photosensitive chip and the circuit board form an integral structure by means of a molding technique, so as to facilitate production.