The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2024

Filed:

Dec. 23, 2021
Applicant:

Semiconductor Energy Laboratory Co., Ltd., Atsugi, JP;

Inventors:

Shunpei Yamazaki, Setagaya, JP;

Hidekazu Miyairi, Isehara, JP;

Akiharu Miyanaga, Hadano, JP;

Kengo Akimoto, Atsugi, JP;

Kojiro Shiraishi, Isehara, JP;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 29/24 (2006.01); H01L 29/66 (2006.01); H01L 29/786 (2006.01); G02F 1/1333 (2006.01); G02F 1/1335 (2006.01); G02F 1/1343 (2006.01); G02F 1/1362 (2006.01); G02F 1/1368 (2006.01); G09G 3/36 (2006.01); H10K 59/121 (2023.01);
U.S. Cl.
CPC ...
H01L 27/1225 (2013.01); H01L 29/247 (2013.01); H01L 29/66969 (2013.01); H01L 29/78618 (2013.01); H01L 29/78648 (2013.01); H01L 29/7869 (2013.01); H01L 29/78693 (2013.01); H01L 29/78696 (2013.01); G02F 1/133345 (2013.01); G02F 1/133528 (2013.01); G02F 1/134336 (2013.01); G02F 1/13439 (2013.01); G02F 1/136286 (2013.01); G02F 1/1368 (2013.01); G02F 2201/123 (2013.01); G09G 3/3674 (2013.01); G09G 2310/0286 (2013.01); H10K 59/1213 (2023.02);
Abstract

An embodiment is to include an inverted staggered (bottom gate structure) thin film transistor in which an oxide semiconductor film containing In, Ga, and Zn is used as a semiconductor layer and a buffer layer is provided between the semiconductor layer and a source and drain electrode layers. The buffer layer having higher carrier concentration than the semiconductor layer is provided intentionally between the source and drain electrode layers and the semiconductor layer, whereby an ohmic contact is formed.


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