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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12068289 B1

PDFFull Text
Date of Patent:
Aug. 20, 2024

Filed:

Aug. 06, 2020

Power module

Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventors:

Kenichi Onodera, Kyoto, JP;

Soichiro Takahashi, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:

HSML P.C.

Primary Examiner:

Ajay Arora

Int. Cl.
CPC ...
H01L 25/07 (2006.01); H01L 23/00 (2006.01); H01L 23/053 (2006.01); H01L 23/14 (2006.01); H01L 23/15 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 23/49 (2006.01);
U.S. Cl.
CPC ...
H01L 25/072 (2013.01); H01L 23/053 (2013.01); H01L 23/142 (2013.01); H01L 23/15 (2013.01); H01L 23/3121 (2013.01); H01L 23/367 (2013.01); H01L 23/49 (2013.01); H01L 24/40 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/40227 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73221 (2013.01);
Abstract

A power module includes a mount layer, a control layer, and a drive layer that are formed on an electrically insulative substrate and multiple power semiconductor elements mounted on the mount layer in one direction and each including a first drive electrode connected to the mount layer, a second drive electrode connected to the drive layer, and a control electrode connected to the control layer. A control terminal is connected to the control layer and a detection terminal is connected to the drive layer. At least one of the control layer and the drive layer includes a detour portion that detours to reduce a difference between the power semiconductor elements in a sum of a length of a first conductive path between the control electrode and the control terminal and a length of a second conductive path between the second drive electrode and the detection terminal.

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