The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2024
Filed:
Dec. 04, 2020
Samsung Electronics Co., Ltd., Suwon-si, KR;
Jongyoun Kim, Seoul, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes a redistribution substrate, and a semiconductor chip disposed on a top surface of the redistribution substrate. The redistribution substrate includes under bump patterns laterally spaced apart from each other, a dummy pattern disposed between the under bump patterns, a passivation pattern disposed on a bottom surface of the dummy pattern, an insulating layer covering top surfaces and sidewalls of the under bump patterns and a sidewall and a top surface of the dummy pattern, and a redistribution pattern disposed on one of the under bump patterns and electrically connected to the one under bump pattern. The passivation pattern includes a different material from that of the insulating layer.