The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2024

Filed:

Jan. 14, 2019
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Xuesong Lu, Santa Clara, CA (US);

Lin Zhang, San Jose, CA (US);

Joseph C. Werner, Santa Clara, CA (US);

Jang Seok Oh, San Ramon, CA (US);

Balaji Pasupathy, Chennai, IN;

Michael W. Johnson, Austin, TX (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); C23C 16/455 (2006.01); C23C 16/50 (2006.01); C23C 16/52 (2006.01); G01K 3/00 (2006.01); G01K 3/04 (2006.01); G01K 3/10 (2006.01); G05B 11/00 (2006.01); G05B 13/02 (2006.01); G05B 15/00 (2006.01); G05B 15/02 (2006.01); H01J 37/32 (2006.01); H01L 21/02 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67248 (2013.01); C23C 16/455 (2013.01); C23C 16/45544 (2013.01); C23C 16/50 (2013.01); C23C 16/52 (2013.01); G01K 3/005 (2013.01); G01K 3/04 (2013.01); G01K 3/10 (2013.01); G05B 11/00 (2013.01); G05B 13/02 (2013.01); G05B 15/00 (2013.01); G05B 15/02 (2013.01); H01J 37/3244 (2013.01); H01J 37/32899 (2013.01); H01L 21/02 (2013.01); H01L 21/02312 (2013.01); H01L 21/67 (2013.01); H01L 21/67017 (2013.01); H01L 21/67103 (2013.01); H01L 21/67109 (2013.01); H01L 21/67167 (2013.01); H01L 21/67207 (2013.01); H01L 21/67253 (2013.01); H01L 21/68742 (2013.01); H01J 2237/24585 (2013.01); H01J 2237/3321 (2013.01);
Abstract

Embodiments herein provide methods of monitoring temperatures of fluid delivery conduits for delivering fluids to, and other components external to, a processing volume of a processing chamber used in electronic device fabrication manufacturing, and monitoring systems related thereto. In one embodiment, a method of monitoring a processing system includes receiving, through a data acquisition device, temperature information from one or more temperature sensors and receiving context information from a system controller coupled to a processing system comprising the processing chamber. Here, the one or more temperature sensors are disposed in one or more locations external to a processing volume of a processing chamber. The context information relates to instructions executed by the system controller to control one or more operations of the processing system.


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