The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2024

Filed:

Sep. 12, 2022
Applicant:

Furukawa Electric Co., Ltd., Tokyo, JP;

Inventors:

Tetsuya Mieda, Tokyo, JP;

Kazuyoshi Akizuki, Tokyo, JP;

Shingo Mitsugi, Tokyo, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01B 3/30 (2006.01); H01B 9/02 (2006.01); H01B 13/00 (2006.01); H01B 13/14 (2006.01);
U.S. Cl.
CPC ...
H01B 13/14 (2013.01); H01B 3/30 (2013.01); H01B 9/02 (2013.01); H01B 13/0016 (2013.01);
Abstract

Provided is a power cable and a method for manufacturing a power cable that reduces occurrence of uneven thickness of an insulating layer and voids and peeling due to shrinkage and has good dielectric breakdown strength. The power cable includes the insulating layer containing 15 mass % or more of a propylene-based resin having a melting point of 110° C. or higher with respect to a whole. The power cable further includes a relationship between a cooling rate X [° C./min] at the time of manufacturing an interface portion in the insulating layer with the inner semiconductive layer and a cooling rate Y [° C./min] at the time of manufacturing a central portion of the insulating layer and is expressed by the relationship (Z), wherein X≥Y×0.8 . . . (Z).


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