The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2024
Filed:
Mar. 12, 2021
Applicant:
Western Digital Technologies, Inc., San Jose, CA (US);
Inventors:
Shrikar Bhagath, San Jose, CA (US);
Dean Jenkins, La Canada-Flintridge, CA (US);
Hedan Zhang, Santa Clara, CA (US);
Bret Winkler, Mission Viejo, CA (US);
Ning Ye, San Jose, CA (US);
Assignee:
Sandisk Technologies, Inc., Milpitas, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 16/30 (2006.01); G06F 30/367 (2020.01); G06F 30/392 (2020.01); G06F 30/398 (2020.01); G06F 113/18 (2020.01); G06F 119/02 (2020.01); G06F 119/06 (2020.01); G06F 119/08 (2020.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
G11C 16/30 (2013.01); G06F 30/367 (2020.01); G06F 30/392 (2020.01); G06F 30/398 (2020.01); H01L 23/367 (2013.01); G06F 2113/18 (2020.01); G06F 2119/02 (2020.01); G06F 2119/06 (2020.01); G06F 2119/08 (2020.01);
Abstract
A data storage device including, in one implementation, a number of memory die packages disposed on a substrate within the data storage device. Each memory die package has a die density that includes one or more memory dies. The die density of each memory die package is configured to provide an even thermal distribution across the number of memory die packages. The respective die densities of two memory of the die packages are different from each other.