The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2024

Filed:

Dec. 12, 2022
Applicant:

Toppan Inc., Tokyo, JP;

Inventors:

Yukiko Katano, Tokyo, JP;

Tetsuya Tsukada, Tokyo, JP;

Shinji Kaneko, Tokyo, JP;

Shigeki Minemura, Tokyo, JP;

Assignee:

TOPPAN INC., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 19/077 (2006.01); G06K 19/07 (2006.01);
U.S. Cl.
CPC ...
G06K 19/0775 (2013.01); G06K 19/0718 (2013.01); G06K 19/07745 (2013.01); G06K 19/07773 (2013.01);
Abstract

A card-type medium includes: a card body; an internal component embedded in the card body; an exposed component partially exposed on a front surface of the card body; and a circuit board to which the internal component and the exposed component are bonded, wherein the circuit board includes a first connection portion to which the internal component is bonded, a second connection portion to which the exposed component is bonded, the second connection portion being located at a position different from the first connection portion in a card thickness direction connecting the front surface of the card body and a rear surface on an opposite side of the card body to the front surface, and a connection wiring portion that connects the first connection portion and the second connection portion, the connection wiring portion extending in a direction including the card thickness direction.


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