The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2024

Filed:

Jun. 14, 2021
Applicant:

Neenah, Inc., Alpharetta, GA (US);

Inventor:

Brian Ciupak, Munising, MI (US);

Assignee:

Neenah, Inc., Alpharetta, GA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41M 5/025 (2006.01); G03G 13/01 (2006.01); G03G 13/20 (2006.01); G03G 15/01 (2006.01); G03G 15/20 (2006.01);
U.S. Cl.
CPC ...
G03G 15/2039 (2013.01); B41M 5/0256 (2013.01); G03G 13/0135 (2021.01); G03G 13/20 (2013.01); G03G 15/0194 (2013.01);
Abstract

Provided are methods of electrophotographically printing an image on a substrate, methods of transferring an image to a substrate, electrophotographic toner cartridge kits, and electrophotographic printing devices. A plurality of layers of toner particles may be electrophotographically printed, using toner cartridges, providing an imaged area that includes one or more colorant layers that include a colorant and a colorant-layer thermoplastic adhesive, and an adhesive layer that includes an adhesive-layer thermoplastic adhesive. The fusing temperature may be selected to heat the colorant-layer thermoplastic adhesive to a temperature greater than an activation temperature of the colorant-layer thermoplastic adhesive and/or an activation temperature of the adhesive-layer thermoplastic adhesive. The melting temperature, the fusing temperature, or melt flow rate of the colorant-layer thermoplastic adhesive corresponding to at least one of the one or more colorant layers may exceed the melting temperature, the fusing temperature, or the melt flow rate of the adhesive-layer thermoplastic adhesive.


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