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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12066692 B1

PDFFull Text
Date of Patent:
Aug. 20, 2024

Filed:

Apr. 19, 2023

Lens driving device with a magnet adhered to an elastic member

Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventor:

Jun Taek Lee, Seoul, KR;

Assignee:

LG INNOTEK CO., LTD., Seoul, KR;

Attorney:

Saliwanchik, Lloyd & Eisenschenk

Primary Examiner:

Gevell V Selby

Int. Cl.
CPC ...
G02B 7/09 (2021.01); G02B 7/08 (2021.01); G02B 27/64 (2006.01); G03B 3/10 (2021.01); G03B 5/00 (2021.01); G03B 13/36 (2021.01); G03B 17/02 (2021.01); G03B 19/22 (2021.01); H04N 23/45 (2023.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01); H04N 23/57 (2023.01); H04N 23/68 (2023.01); H04N 23/90 (2023.01);
U.S. Cl.
CPC ...
G02B 7/09 (2013.01); G02B 7/08 (2013.01); G02B 27/646 (2013.01); G03B 3/10 (2013.01); G03B 5/00 (2013.01); G03B 13/36 (2013.01); G03B 17/02 (2013.01); G03B 19/22 (2013.01); H04N 23/45 (2023.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01); H04N 23/57 (2023.01); H04N 23/687 (2023.01); H04N 23/90 (2023.01); G03B 2205/0007 (2013.01); G03B 2205/0069 (2013.01);
Abstract

The present embodiment relates to a dual camera module comprising: a substrate; a first image sensor disposed on the substrate; a second image sensor disposed on the substrate while being spaced apart from the first image sensor; a housing disposed on the upper side of the substrate; a first bobbin disposed on the upper side of the first image sensor inside the housing; a second bobbin disposed on the upper side of the second image sensor inside the housing; a first coil disposed in the first bobbin; a second coil disposed in the second bobbin; and a first magnet which is disposed between the first coil and the second coil and faces the first coil and the second coil.

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