The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2024
Filed:
Aug. 09, 2022
Cirrus Logic International Semiconductor Ltd., Edinburgh, GB;
Vamsikrishna Parupalli, Austin, TX (US);
Zhong You, Austin, TX (US);
CIRRUS LOGIC, INC., Austin, TX (US);
Abstract
An integrated circuit (IC) provides on-line, wafer-level, die-level, or package-level thermal calibration of an integrated thin-film resistor, by thermally enclosing the thin-film resistor with metal layers formed above and below the thin-film resistor along its length and width. Metal vias thermally couple the metal layers to the substrate to at least partially equalize the temperature of the metal layers and the thin-film resistor and the substrate. A controllable heat source, which may be provided by another thin-film resistor integrated on or below the substrate, and a reference temperature sensor provide heating/calibration measurement of the resistance of the thin-film resistor over a range of temperature. The reference temperature sensor may be provided within the IC, for example, integrated on the substrate or packaged with the die containing the thin-film resistor, or may be otherwise thermally coupled to the metal layers, e.g., by an extension of one of the metal layers.