The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2024

Filed:

Feb. 27, 2024
Applicant:

Shenzhen University, Shenzhen, CN;

Inventors:

Minghui Li, Shenzhen, CN;

Heping Xie, Shenzhen, CN;

Jun Lu, Shenzhen, CN;

Mingzhong Gao, Shenzhen, CN;

Cunbao Li, Shenzhen, CN;

Hongwei Zhou, Shenzhen, CN;

Cancan Chen, Shenzhen, CN;

Zhouqian Wu, Shenzhen, CN;

Delei Shang, Shenzhen, CN;

Assignee:

SHENZHEN UNIVERSITY, Shenzhen, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 33/24 (2006.01); G01N 29/04 (2006.01); G01N 29/22 (2006.01); G01N 29/44 (2006.01);
U.S. Cl.
CPC ...
G01N 33/24 (2013.01); G01N 29/046 (2013.01); G01N 29/223 (2013.01); G01N 29/228 (2013.01); G01N 29/4409 (2013.01);
Abstract

The present invention relates to a deep rock in situ environment reconstruction and integrated three-dimensional mechanical-thermo-acousto-seismic-flow testing method, which comprises: preparing a cubic sample; placing the cubic sample in a sample holder; extending the 6 indenters to butt with the sample holder; butting 6 butting indenters with the 6 indenters; butting each of 6 hydraulic actuators with one of the butting indenters, performing stress loading on the cubic sample by the hydraulic actuator, filling a fluid medium into the cubic sample by a percolation medium channel, and dynamically measuring related parameters. The present application can achieve three-way multi-parameter synchronous monitoring and acquisition of deformation, acoustic emission, ultrasonic wave, temperature field, percolation field and heat flow field.


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