The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2024

Filed:

Jan. 18, 2022
Applicant:

Baker Hughes Holdings Llc, Houston, TX (US);

Inventors:

Navin Sakthivel, Spring, TX (US);

Mikhail Anisimov, The Woodlands, TX (US);

Joerg Weislogel, Karlsruhe, DE;

Martin Berthold Spies, Saarbruecken, DE;

Aaron Avagliano, The Woodlands, TX (US);

Sandip Maity, Manama, BH;

Amir Saeed, Katy, TX (US);

Sreedhar Puliyakote, Karlsruhe, DE;

Assignee:

Baker Hughes Holdings LLC, Houston, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 27/90 (2021.01); B22F 5/12 (2006.01); B29C 64/153 (2017.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01); G01N 29/04 (2006.01);
U.S. Cl.
CPC ...
G01N 27/9006 (2013.01); B22F 5/12 (2013.01); B29C 64/153 (2017.08); G01N 29/041 (2013.01); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12);
Abstract

A method of manufacturing is provided. The method can include determining a cross-sectional shape of an object to be inspected using a sensor configured with a sensor coil. The method can also include providing a substrate having a profile matching the cross-sectional shape of the object. The method can further include applying a dielectric material to the substrate in a patter matching a shape of the sensor coil. The method can also include forming a first layer of a first material on the dielectric material by sputtering particles of the first material on the dielectric material in the pattern and forming additional layers of the first material atop the first layer by iteratively depositing the additional layers in the pattern via an additive manufacturing technique. A sensor including a sensor coil formed via the method is also provided.


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