The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2024

Filed:

Apr. 27, 2021
Applicant:

Wuxi Wuyue Semiconductor Co. Ltd., Wuxi, CN;

Inventors:

Haitao Zhang, Wuxi, CN;

Bin Xu, Wuxi, CN;

Bo Pang, Wuxi, CN;

Lianghong Liu, Wuxi, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C30B 25/18 (2006.01); C23C 14/06 (2006.01); C23C 14/34 (2006.01); C23C 14/58 (2006.01); C30B 25/16 (2006.01); C30B 29/40 (2006.01);
U.S. Cl.
CPC ...
C30B 25/183 (2013.01); C23C 14/0617 (2013.01); C23C 14/34 (2013.01); C23C 14/5806 (2013.01); C30B 25/16 (2013.01); C30B 29/406 (2013.01);
Abstract

The present invention provides a preparation method of a gallium nitride single crystal based on a ScAlMgOsubstrate, comprising following steps: (1) providing a ScAlMgOsubstrate; (2) growing a buffer layer on a surface of the ScAlMgOsubstrate; (3) annealing the buffer layer; (4) growing a GaN crystal on the buffer layer; (5) performing cooling, so that the GaN crystal is automatically peeled off from the ScAlMgOsubstrate. The present invention does not need to use a complex MOCVD process for GaN deposition and preprocessing to make a mask or a separation layer, which effectively reduces production costs; compared with traditional substrates such as sapphire, it has higher quality and a larger radius of curvature, and will not cause a problem of OFFCUT non-uniformity for growing GaN over 4 inches; finally, the present invention can realize continuous growth into a crystal bar with a thickness of more than 5 mm, which further reduces the costs.


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