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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12065597 B1

PDFFull Text
Date of Patent:
Aug. 20, 2024

Filed:

Aug. 27, 2020

Adhesive tape

Applicant:

Dic Corporation, Tokyo, JP;

Inventor:

Daisuke Watanabe, Kitaadachi-gun, JP;

Assignee:

DIC CORPORATION, Tokyo, JP;

Attorney:

WHDA, LLP

Primary Examiner:

Cheng Yuan Huang

Int. Cl.
CPC ...
C09J 7/24 (2018.01); C08K 3/22 (2006.01); C09J 11/04 (2006.01); C09J 11/08 (2006.01); C09J 133/08 (2006.01);
U.S. Cl.
CPC ...
C09J 7/243 (2018.01); C08K 3/22 (2013.01); C09J 7/245 (2018.01); C09J 11/04 (2013.01); C09J 11/08 (2013.01); C09J 133/08 (2013.01); C08K 2003/2227 (2013.01); C08K 2201/003 (2013.01); C09J 2301/124 (2020.08); C09J 2301/312 (2020.08); C09J 2301/408 (2020.08); C09J 2301/502 (2020.08); C09J 2409/001 (2013.01); C09J 2423/041 (2013.01); C09J 2423/101 (2013.01); C09J 2425/001 (2013.01); C09J 2433/00 (2013.01); C09J 2453/001 (2013.01); C09J 2483/00 (2013.01);
Abstract

An object of the present invention is to provide an adhesive tape that can be removed from an adherend more easily and more rapidly. The adhesive tape of the present invention includes a base material layer, and adhesive layers on both sides of the base material layer, the base material layer has a thickness of 10 to 100 μm, a breaking strength of 20 to 90 MPa, a breaking elongation of 400% to 1,500%, and a 100% modulus of 1 to 5 MPa, and an adhesive composition forming the adhesive layers contains 1% to 40% by mass of filler particles having an average particle diameter of 0.1 to 40 μm with respect to 100% by mass of the adhesive composition.

Find Patent Forward Citations

Watanabe, Daisuke. (2024). Adhesive tape (U.S. Patent No. 12065597). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12065597

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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