The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2024
Filed:
Mar. 23, 2022
Avery Dennison Corporation, Mentor, OH (US);
Eric L. Bartholomew, Mill Hall, PA (US);
William L. Bottorf, Mill Hall, PA (US);
Kyle R. Heimbach, Millmont, PA (US);
Brandon S. Miller, Lock Haven, PA (US);
Michael T. Waterman, Chardon, OH (US);
Michael T. Zajaczkowski, Bellefonte, PA (US);
Qiang Luo, State College, PA (US);
Andrew P. Full, State College, PA (US);
Christopher E. Kohler, S. Williamsport, PA (US);
Avery Dennison Corporation, Mentor, OH (US);
Abstract
Methods for forming melt processable, actinic radiation polymerizable and crosslinkable adhesives are described. In certain versions, the adhesives or pre-adhesive compositions include two initiators and are polymerized and/or crosslinked by exposure to actinic radiation such as UV light or electron beam radiation. Also described are pre-adhesive compositions including polymerizable monomers, articles including the adhesives, and various methods and systems related to the adhesives and their application. In addition, various apparatuses are described for polymerizing or crosslinking the compositions.