The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2024
Filed:
Apr. 27, 2023
Hyundai Motor Company, Seoul, KR;
Kia Corporation, Seoul, KR;
BS Technics Co., Ltd., Ansan-si, KR;
Nifco Korea Inc., Anyang-si, KR;
Hyundai Mobis Co., Ltd., Seoul, KR;
Alps Electric Korea Co., Ltd., Gwangju, KR;
Jun Sik Kim, Gwacheon-si, KR;
Jung Sik Choi, Siheung-si, KR;
Young Do Kim, Ansan-si, KR;
Tae Kyoung Jung, Bucheon-si, KR;
Seung-Sik Han, Hwaseong-si, KR;
Hong-Sik Chang, Hwaseong-si, KR;
Kwang-Pyo Cho, Gwangmyeong-si, KR;
Young-Ju Lee, Suwon-si, KR;
Jong-Hyun Park, Uiwang-si, KR;
Jin-Won Lee, Suwon-si, KR;
Jun-Geun Oh, Hwaseong-si, KR;
Cheon-Ho Kim, Hwaseong-si, KR;
Young-Jai Im, Hwaseong-si, KR;
Sun-Mi Oh, Bucheon-si, KR;
Kang-Sun Lee, Seongnam-si, KR;
Sae-Ah Kim, Hwaseong-si, KR;
Jong-Eun Park, Yongin-si, KR;
Kwan-Woo Lee, Yongin-si, KR;
Jong-Chae Lee, Anyang-si, KR;
Jun-Hyun Park, Anyang-si, KR;
Won-Il Lee, Gwangju, KR;
Dae-Woo Park, Gwangju, KR;
HYUNDAI MOTOR COMPANY, Seoul, KR;
KIA CORPORATION, Seoul, KR;
BS TECHNICS CO., LTD., Ansan-si, KR;
NIFCO KOREA INC., Asan-si, KR;
HYUNDAI MOBIS CO., LTD., Seoul, KR;
ALPS ELECTRIC KOREA CO., LTD., Gwangju, KR;
Abstract
A light-emitting diode (LED) lamp for a vehicle and a method of manufacturing the same use MID and magnetic induction technologies. The LED lamp includes a LED module, a housing accommodating the LED module, and a molded interconnect device (MID) electrode formed on a surface of the housing. The LED module may be mounted on the MID electrode by soldering using magnetic induction heating, the housing may be an injection molded product, and the MID electrode may be formed on the housing using a MID process.