The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2024

Filed:

Oct. 24, 2019
Applicant:

Dai Nippon Printing Co., Ltd., Tokyo, JP;

Inventors:

Daisuke Yasuda, Tokyo, JP;

Makoto Amano, Tokyo, JP;

Takanori Yamashita, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/12 (2006.01); B32B 27/08 (2006.01);
U.S. Cl.
CPC ...
B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 2307/31 (2013.01); B32B 2307/7265 (2013.01); B32B 2457/10 (2013.01);
Abstract

A casing material for a power storage device, including a laminate that includes, in order, at least a base material layer, a barrier layer, and a heat-fusible resin layer. The heat-fusible resin layer includes a single layer or a plurality of layers. The heat-fusible resin layer includes at least one layer having a hardness of at least 70 MPa from a cross-section in the lamination direction of the laminate, measured using a nanoindentation method using an indentation load of 100 μN.


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