The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2024
Filed:
Apr. 12, 2019
Artience Co., Ltd., Tokyo, JP;
Toyo Ink Co., Ltd., Tokyo, JP;
Kouichi Tosaki, Tokyo, JP;
Atsushi Nakazato, Tokyo, JP;
artience Co., Ltd., Tokyo, JP;
TOYO INK CO., LTD., Tokyo, JP;
Abstract
Provided is a conductive composition for molded film that enables production of a molded film for which tensile force-induced reductions in conductivity are suppressed. The conductive composition for molded film contains a resin (A), conductive fine particles (B), and a solvent (C), wherein the solvent (C) contains, in 100 parts by mass of the solvent (C), at least 40 parts by mass of a solvent (C') that satisfies the following condition (1) and condition (2). (1) A boiling point of 180° C. to 270° C. (2) At least one of the following is satisfied: the polar parameter δp of the Hansen solubility parameter (HSP) is 0≤δp≤5.0, and the hydrogen-bond parameter δh of the Hansen solubility parameter (HSP) is 9.8≤δh≤4.0.