The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2024
Filed:
May. 15, 2020
Mitsui Chemicals, Inc., Tokyo, JP;
MITSUI CHEMICALS, INC., Tokyo, JP;
Abstract
An injection molding apparatus includes a substantially circular first substrate, a substantially circular second substrate disposed to face a surface of the first substrate, a fixing member which fixes a peripheral end portion of the first substrate and a peripheral end portion of the second substrate, and an injection portion which is provided in the fixing member and from which a composition is injected into a gap between the first substrate and the second substrate, in which a space connecting with the injection portion and the gap is provided in at least a part of a periphery of the gap, and a width of the space in a thickness direction is larger than a width of the gap in the thickness direction.