The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2024

Filed:

May. 12, 2021
Applicant:

Advanced Neuromodulation Systems, Inc., Plano, TX (US);

Inventors:

Ryan Sefkow, Frisco, TX (US);

Christopher A. Crawford, Carrollton, TX (US);

Jeffrey Mitchell, Little Elm, TX (US);

Kevin Wilson, McKinney, TX (US);

Raymond P. Bray, Dallas, TX (US);

John R. Gonzalez, Frisco, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
A61N 1/05 (2006.01); B29C 45/00 (2006.01); B29C 45/14 (2006.01); B29K 75/00 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
A61N 1/0534 (2013.01); B29C 45/0055 (2013.01); B29C 45/14311 (2013.01); B29C 45/14467 (2013.01); B29C 45/14565 (2013.01); B29C 45/14614 (2013.01); B29C 2045/14524 (2013.01); B29C 45/14639 (2013.01); B29C 2793/009 (2013.01); B29K 2075/00 (2013.01); B29K 2995/0056 (2013.01); B29L 2031/7546 (2013.01);
Abstract

In one embodiment, a method for fabricating a neurostimulation stimulation lead comprises: providing a plurality of ring components and hypotubes in a mold; placing an annular frame with multiple lumens over distal ends of the plurality of hypotubes to position a portion of each hypotube within a respective lumen of the annular frame; molding the plurality of ring components and the hypotubes to form a stimulation tip component for the stimulation lead, wherein the molding fills interstitial spaces between the plurality of ring components and hypotubes with insulative material; and forming segmented electrodes from the ring components after performing the molding.


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