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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12063832 B1

PDFFull Text
Date of Patent:
Aug. 13, 2024

Filed:

Mar. 30, 2023

Light-emitting device and tiled display comprising the same

Applicant:

Innolux Corporation, Miao-Li County, TW;

Inventors:

Shun-Yuan Hu, Miao-Li County, TW;

Chin-Lung Ting, Miao-Li County, TW;

Li-Wei Mao, Miao-Li County, TW;

Ming-Chun Tseng, Miao-Li County, TW;

Kung-Chen Kuo, Miao-Li County, TW;

M-Hua Hsu, Miao-Li County, TW;

Ker-Yih Kao, Miao-Li County, TW;

Assignee:

INNOLUX CORPORATION, Miao-Li County, TW;

Attorney:

McClure, Qualey & Rodack, LLP

Primary Examiner:

Sardis F Azongha

Int. Cl.
CPC ...
H10K 59/18 (2023.01); G09F 9/302 (2006.01); G09G 3/00 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2023.01); H01L 27/12 (2006.01); H10K 50/86 (2023.01); H10K 59/131 (2023.01); H10K 77/10 (2023.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H10K 59/18 (2023.02); G09F 9/3026 (2013.01); G09G 3/006 (2013.01); H01L 24/24 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 25/162 (2013.01); H01L 25/167 (2013.01); H01L 27/124 (2013.01); H10K 50/865 (2023.02); H10K 59/131 (2023.02); H10K 77/111 (2023.02); H01L 22/14 (2013.01); H01L 2224/24226 (2013.01); H01L 2224/245 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/92244 (2013.01);
Abstract

A light-emitting device is provided. The light-emitting device includes a circuit substrate, an array substrate, a plurality of light-emitting units and a driver. The circuit substrate has a top surface. A top circuit is disposed on the top surface. The array substrate is disposed on the top surface of the circuit substrate and electrically connected to the top circuit. The light-emitting units are disposed on the array substrate. The light-emitting device further includes an electrical connection structure, a plurality of light extraction layers, a protective layer, a plurality of test pads, and a light absorption layer. The plurality of test pads are disposed on the array substrate, and the light absorption layer covers at least one of the test pads.

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