The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2024

Filed:

Aug. 27, 2020
Applicants:

Chengdu Boe Optoelectronics Technology Co., Ltd., Chengdu, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Yiming Wang, Beijing, CN;

Haotian Yang, Beijing, CN;

Fuzheng Xie, Beijing, CN;

Xiaoxia Liu, Beijing, CN;

Kang Wang, Beijing, CN;

Junhui Yang, Beijing, CN;

Jiaxiang Zhang, Beijing, CN;

Zhenhua Zhang, Beijing, CN;

Renzhe Xu, Beijing, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/041 (2006.01); H04M 1/02 (2006.01); H10K 50/86 (2023.01); H10K 59/131 (2023.01); H10K 59/40 (2023.01); H10K 77/10 (2023.01); H10K 102/00 (2023.01);
U.S. Cl.
CPC ...
H10K 59/131 (2023.02); G06F 3/041 (2013.01); H04M 1/0266 (2013.01); H10K 50/86 (2023.02); H10K 59/40 (2023.02); H10K 77/111 (2023.02); G06F 2203/04102 (2013.01); H10K 2102/311 (2023.02);
Abstract

A display device includes a flexible display panel including a display part, a bonding part, and a substrate bending part connecting the display part and the bonding part, the bonding part being located on the back side of the display part, and a side of the bonding part away from the display part being the bonding side, the driving chip being arranged on the bonding side of the bonding part, and having a first side and a second side opposite in the first direction, where the first side is close to the substrate bending part, and the second side is distal to the substrate bending part, the first direction being perpendicular to the thickness direction; a main flexible circuit board, disposed on the second side of the driving chip and connected to the bonding side of the bonding part; a touch layer; and a control flexible circuit board.


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