The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2024

Filed:

Apr. 14, 2021
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Mi Sun Lee, Seoul, KR;

Yong Joo Lee, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20509 (2013.01); H05K 7/20336 (2013.01);
Abstract

The present invention relates to a heat sink comprising a heat pipe. A heat sink, according to one embodiment of the present invention, comprises: a first heat pipe mounted in a first groove formed on a first surface of a heat sink; a second heat pipe mounted in a second groove formed on a second surface of the heat sink; and a third groove in which at least a portion of the second heat pipe mounted in the second groove is exposed in the direction of the first surface. A method for producing a heat sink comprises the steps of: forming, on a first surface of a heat sink, a first groove in which a first heat pipe is mounted; mounting the first heat pipe on the first surface by disposing and press-fitting the first heat pipe in the first groove; forming, on a second surface of the heat sink, a second groove in which a second heat pipe is mounted; mounting the second heat pipe on the second surface by disposing and press-fitting the second heat pipe in the second groove; and forming a third groove such that at least a portion of the second heat pipe is exposed in the direction of the first surface.


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