The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2024
Filed:
Feb. 01, 2022
Applicant:
Fukuda Metal Foil & Powder Co., Ltd., Kyoto, JP;
Inventors:
Takeshi Okamoto, Kyoto, JP;
Kenta Miyamoto, Kyoto, JP;
Assignee:
FUKUDA METAL FOIL & POWDER CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 (2006.01); H05K 1/09 (2006.01); H05K 3/02 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
H05K 3/022 (2013.01); H05K 1/09 (2013.01); H05K 3/384 (2013.01); H05K 2201/0355 (2013.01);
Abstract
A surface-treated copper foil includes, on at least one surface of an untreated copper foil, a finely roughened layer formed of copper particles in which primary particles have a particle size of 10 nm to 110 nm or less, and a heat-resistant-treatment layer containing nickel and phosphorus, wherein a treated surface has a surface area ratio of 5.1 or more per 1 mof a two-dimensional area, the surface area ratio being calculated from a specific surface area measured by a krypton gas adsorption BET method, and a coating mass of the nickel is 2 mg or more per 1 mof a surface area.