The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2024

Filed:

Apr. 26, 2021
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Hae Sik Kim, Seoul, KR;

Jee Heum Paik, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H04N 23/68 (2023.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0296 (2013.01); H04N 23/687 (2023.01); H05K 1/116 (2013.01); H05K 2201/0939 (2013.01); H05K 2201/09618 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10287 (2013.01);
Abstract

A circuit board according to an embodiment includes an insulating layer; and a lead pattern portion disposed on the insulating layer, wherein the lead pattern portion includes: a first portion disposed on the insulating layer; and a second portion extending from one end of the first portion; wherein the first portion is disposed overlapping the insulating layer in a vertical direction, wherein the second portion is disposed in an outer region of the insulating layer and does not overlap the insulating layer; and wherein the lead pattern portion has a centerline average roughness in a range of 0.05 μm to 0.5 μm or a 10-point average roughness in a range of 1.0 μm to 5.0 μm.


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