The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2024

Filed:

Jul. 17, 2023
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Snehamay Sinha, Plano, TX (US);

Tapobrata Bandyopadhyay, Dallas, TX (US);

Markarand Ramkrishna Kulkarni, Dallas, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H01L 21/02 (2006.01); H01L 23/06 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0221 (2013.01); H01L 21/02008 (2013.01); H01L 23/06 (2013.01); H05K 1/0222 (2013.01); H05K 1/0245 (2013.01); H05K 1/115 (2013.01); H05K 3/42 (2013.01);
Abstract

An electronic substrate includes a dielectric core, a first conducting layer on a first side of the core and a second conducting layer on the second side of the core opposite the first side. At least one differential coaxial through-via includes a first inner signal through-via that is at least electrical conductor lined for a first signal path and at least a second inner signal through-via that is also at least electrical conductor lined positioned side-by-side and being dielectrically isolated from the first inner signal through-via for a second signal path. An annular-shaped outer ground shield enclosure is at least conductor lined that surrounds and is dielectrically isolated from both the first and second inner signal through-vias.


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