The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2024
Filed:
Jun. 15, 2023
Applicant:
Xmems Labs, Inc., Santa Clara, CA (US);
Inventors:
Chao-Yu Chen, Kaohsiung, TW;
Wen-Chien Chen, New Taipei, TW;
Chiung C. Lo, San Jose, CA (US);
Hai-Hung Wen, Hsinchu County, TW;
Assignee:
xMEMS Labs, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 1/28 (2006.01); B81B 7/00 (2006.01); H04R 1/02 (2006.01); H04R 7/04 (2006.01); H04R 19/00 (2006.01);
U.S. Cl.
CPC ...
H04R 1/2811 (2013.01); B81B 7/0061 (2013.01); H04R 1/025 (2013.01); H04R 7/04 (2013.01); H04R 19/00 (2013.01); B81B 2201/0257 (2013.01); B81B 2203/0127 (2013.01); H04R 2201/003 (2013.01);
Abstract
An acoustic package structure includes a substrate, a covering structure and an acoustic chip. The covering structure is disposed on the substrate and has a plurality of first openings. The acoustic chip is disposed between the substrate and the covering structure, wherein the acoustic chip includes a membrane.