The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2024
Filed:
Aug. 03, 2021
Mitsubishi Electric Corporation, Tokyo, JP;
Masato Moriwaki, Tokyo, JP;
Fumihito Izawa, Tokyo, JP;
Yohei Araki, Tokyo, JP;
Noriyuki Matsubara, Hyogo, JP;
Masato Achihara, Hyogo, JP;
Yuya Yamashita, Hyogo, JP;
MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;
Abstract
A booster circuit includes, at a substrate end of an insulating substrate, an input part of voltage, an output part of voltage, and a conductive L-shaped joint fitting. The L-shaped joint fitting includes a plate-shaped bottom surface portion attached to the insulating substrate and a plate-shaped back surface portion bent from the bottom surface portion and extending in a specific direction. In the input part and the output part, a capacitor, a diode, and a connection line connecting the insulating substrates are electrically connected at a component connecting portion, and the L-shaped joint fitting is disposed such that a lead forming portion of a lead connected to the capacitor, a lead forming portion of a lead connected to the diode, and the component connecting portion fit within an area of a main surface of the back surface portion and an area of a main surface of the bottom surface portion.