The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2024

Filed:

Jul. 10, 2023
Applicant:

University of Zagreb, Faculty of Electrical Engineering and Computing, Zagreb, HR;

Inventors:

Tomislav Suligoj, Zagreb, HR;

Marko Koricic, Zagreb, HR;

Josip Zilak, Zagreb, HR;

Zeljko Osrecki, Zagreb, HR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/165 (2006.01); H01L 29/08 (2006.01); H01L 29/10 (2006.01); H01L 29/40 (2006.01); H01L 29/417 (2006.01); H01L 29/66 (2006.01); H01L 29/735 (2006.01); H01L 29/737 (2006.01); H01L 21/8249 (2006.01);
U.S. Cl.
CPC ...
H01L 29/165 (2013.01); H01L 29/0808 (2013.01); H01L 29/1008 (2013.01); H01L 29/401 (2013.01); H01L 29/41708 (2013.01); H01L 29/66242 (2013.01); H01L 29/735 (2013.01); H01L 29/737 (2013.01); H01L 21/8249 (2013.01); H01L 29/66545 (2013.01);
Abstract

A semiconductor device including a Horizontal Current Bipolar Transistor (HCBT) and methods of manufacture. The device has a semiconductor substrate of a first conductivity type defining a wafer plane parallel to the semiconductor substrate and has a base region and a collector region forming a first metallurgical junction. The device also has an emitter region forming a second metallurgical junction with the base region. A flat portion of the first metallurgical junction and a flat portion of the second metallurgical junction are substantially parallel to each other and close an acute angle with the wafer plane. At least a portion of the base region comprises silicon-germanium alloy or silicon-germanium-carbon alloy.


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