The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2024
Filed:
Jul. 03, 2023
Applicant:
Jade Bird Display (Shanghai) Limited, Shanghai, CN;
Inventors:
Qunchao Xu, Shanghai, CN;
Qiming Li, Albuquerque, NM (US);
Assignee:
JADE BIRD DISPLAY (SHANGHAI) LIMITED, Shanghai, CN;
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); H01L 27/12 (2006.01); H01L 33/58 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 27/1214 (2013.01); H01L 33/58 (2013.01); H01L 33/62 (2013.01);
Abstract
A slicing micro-light emitting diode (LED) wafer includes a driver circuit substrate, a plurality of micro-LEDs formed on the driver circuit substrate, the plurality of micro-LEDs being made from a plurality of epitaxial layer slices arranged side-by-side on the driver circuit substrate, and a bonding layer, formed at bottoms of the plurality of epitaxial layer slices and on a top surface of the driver circuit substrate, for bonding the micro-LEDs and the driver circuit substrate.