The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2024
Filed:
Nov. 18, 2021
Samsung Electronics Co., Ltd., Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes a lower substrate including a central region and an edge region, an upper substrate on the central region of the lower substrate, a first semiconductor chip on the upper substrate, a second semiconductor chip on the upper substrate and horizontally spaced apart from the first semiconductor chip, a reinforcing structure on the edge region of the lower substrate, and a molding layer that covers an inner sidewall of the reinforcing structure, a top surface of the lower substrate, a sidewall of the first semiconductor chip, a sidewall of the second semiconductor chip, and the upper substrate. The molding layer is interposed between the lower substrate and the upper substrate, between the upper substrate and the first semiconductor chip, and between the upper substrate and the second semiconductor chip. The first semiconductor chip is of a different type from the second semiconductor chip.