The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2024
Filed:
Sep. 20, 2023
Applicant:
Fuji Electric Co., Ltd., Kanagawa, JP;
Inventor:
Yasuaki Hozumi, Tokyo, JP;
Assignee:
FUJI ELECTRIC CO., LTD., Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); H01L 24/03 (2013.01); H01L 24/48 (2013.01); H01L 2224/0221 (2013.01); H01L 2224/02215 (2013.01); H01L 2224/03825 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05644 (2013.01);
Abstract
A semiconductor module includes: a semiconductor device; a bonding layer that is arranged on the semiconductor device, and contains nickel or copper, an entire back surface of the bonding layer being electrically connected to and in direct contact with an electrode in the semiconductor device; an anti-oxidation layer disposed on the bonding layer; and a protective layer disposed directly on a top surface of a peripheral portion of the bonding layer on which the anti-oxidation layer is absent, covering an outer peripheral edge of the bonding layer, wherein the protective layer is made of an electrically insulating resin.