The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2024

Filed:

Jul. 30, 2021
Applicant:

Realtek Semiconductor Corp., Hsinchu, TW;

Inventors:

Yu-Hsin Wang, Hsinchu, TW;

Nai-Jen Hsuan, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49541 (2013.01); H01L 23/3107 (2013.01); H01L 23/4952 (2013.01); H01L 24/48 (2013.01); H01L 2224/48177 (2013.01);
Abstract

An integrated circuit lead frame and a semiconductor device thereof are provided. The integrated circuit lead frame includes a die pad and a plurality of leads. The die pad is provided to attach a die. The plurality of leads are provided for connection to the die through wire bonding. The leads include a pair of a first lead and a second lead. The first lead includes a first body and a first extension portion connected to the first body. The second lead includes a second body and a second extension portion connected to the second body. The first extension portion and the second extension portion extend in directions toward each other.


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