The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2024
Filed:
Jun. 24, 2020
Mitsubishi Electric Corporation, Tokyo, JP;
Masatake Harada, Fukuoka, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
According to the present disclosure, a semiconductor device includes a substrate, a semiconductor chip provided on the substrate, a case having a wall portion provided on the substrate and surrounding the semiconductor chip, and an overhang protruding from the wall portion toward an inside of a region surrounded by the wall portion and a resin that fills the region surrounded by the wall portion, wherein the overhang has an upper surface, and an inclined surface that is provided below the upper surface and on which a distance to the substrate decreases with an increase in distance from a tip of the overhang, the overhang being provided with a through hole penetrating from the inclined surface to the upper surface, and the through hole extends perpendicularly from the inclined surface.