The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2024
Filed:
Mar. 11, 2020
Applicant:
Tokai Carbon Korea Co., Ltd, Gyeonggi-do, KR;
Inventor:
Kyoung Jun Kim, Gyeonggi-do, KR;
Assignee:
TOKAI CARBON KOREA CO., LTD, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/687 (2006.01); H01J 37/32 (2006.01); H01L 21/02 (2006.01); H01L 21/3065 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68721 (2013.01); H01J 37/32642 (2013.01); H01L 21/02167 (2013.01); H01L 21/02274 (2013.01); H01L 21/3065 (2013.01); H01L 21/31116 (2013.01); H01J 2237/332 (2013.01); H01J 2237/334 (2013.01);
Abstract
Described herein are edge ring among components for manufacturing semiconductors used in a semiconductor manufacturing process. The SiC edge ring includes: a first deposition part having a plasma-damaged portion and a non-damaged portion and including SiC; and a second deposition part formed on the first deposition part and including SiC, wherein a boundary between the damaged portion of the first deposition part and the second deposition part includes an uneven surface.