The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2024

Filed:

Apr. 09, 2020
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Zubin Huang, Santa Clara, CA (US);

Rui Cheng, San Jose, CA (US);

Diwakar Kedlaya, San Jose, CA (US);

Satish Radhakrishnan, San Jose, CA (US);

Anton V. Baryshnikov, Santa Clara, CA (US);

Venkatanarayana Shankaramurthy, Santa Clara, CA (US);

Karthik Janakiraman, San Jose, CA (US);

Paul L. Brillhart, Santa Clara, CA (US);

Badri N. Ramamurthi, Los Gatos, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01J 37/32 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6838 (2013.01); H01J 37/32724 (2013.01); H01L 21/67017 (2013.01); H01L 21/67167 (2013.01); H01L 21/67253 (2013.01); H01J 2237/186 (2013.01); H01J 2237/24585 (2013.01);
Abstract

Exemplary methods of semiconductor processing may include coupling a fluid conduit within a substrate support in a semiconductor processing chamber to a system foreline. The coupling may vacuum chuck a substrate with the substrate support. The methods may include flowing a gas into the fluid conduit. The methods may include maintaining a pressure between the substrate and the substrate support at a pressure higher than the pressure at the system foreline.


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