The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2024

Filed:

Dec. 21, 2020
Applicants:

Sumitomo Heavy Industries, Ltd., Tokyo, JP;

Fuji Electric Co., Ltd., Kanagawa, JP;

Inventors:

Takeshi Aiba, Kanagawa, JP;

Hiroshi Takishita, Kanagawa, JP;

Takashi Yoshimura, Kanagawa, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/32 (2006.01); B23K 26/03 (2006.01); B23K 26/32 (2014.01); H01L 21/268 (2006.01); H01L 21/324 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
H01L 21/268 (2013.01); B23K 26/032 (2013.01); B23K 26/32 (2013.01); H01L 21/324 (2013.01); B23K 2101/40 (2018.08);
Abstract

A laser annealing method for a semiconductor device, includes: a first step of adding an impurity to a semiconductor substrate; and a second step of irradiating a region to which the impurity is added with a pulsed laser beam a plurality of times to anneal the semiconductor substrate. In the second step, a first region of a portion of the region to which the impurity is added is irradiated with the pulsed laser beam, and after a predetermined time interval, a second region adjacent to the first region is irradiated with the pulsed laser beam. The predetermined time interval is larger than a pulse interval of the pulsed laser beam.


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