The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2024

Filed:

Mar. 10, 2023
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventor:

Dong Jin Jeong, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 17/00 (2006.01); H01F 17/04 (2006.01); H01F 17/06 (2006.01); H01F 27/29 (2006.01);
U.S. Cl.
CPC ...
H01F 17/0013 (2013.01); H01F 17/0006 (2013.01); H01F 17/06 (2013.01); H01F 27/292 (2013.01); H01F 2017/0073 (2013.01); H01F 2017/048 (2013.01);
Abstract

There are provided a chip electronic component and a board having the same. The chip electronic component includes: a substrate; a first internal coil part disposed on one surface of the substrate; a second internal coil part disposed on the other surface of the substrate opposing one surface thereof; a via penetrating through the substrate to connect the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via, wherein the first and second via pads are extended in a direction toward portions of the first and second internal coil parts adjacent thereto.


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