The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2024

Filed:

May. 25, 2022
Applicant:

Meta Platforms, Inc., Menlo Park, CA (US);

Inventors:

Pankaj Kansal, Fremont, CA (US);

Arvind Srinivasan, San Jose, CA (US);

Harikrishna Madadi Reddy, San Jose, CA (US);

Naader Hasani, Menlo Park, CA (US);

Assignee:

META PLATFORMS, INC., Menlo Park, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 16/23 (2019.01); G06F 9/30 (2018.01); G06F 9/54 (2006.01);
U.S. Cl.
CPC ...
G06F 9/546 (2013.01); G06F 9/3005 (2013.01); G06F 9/544 (2013.01);
Abstract

A system includes a first integrated circuit package including a first group of one or more artificial intelligence processing units and a first chip-to-chip interconnect communication unit and a second integrated circuit package including a second group of one or more artificial intelligence processing units and a second chip-to-chip interconnect communication unit. The system also includes an interconnect between the first integrated circuit package and the second integrated circuit package, wherein the first chip-to-chip interconnect communication unit and the second chip-to-chip interconnect communication unit manage ethernet-based communication via the interconnect using a layered communication architecture supporting a credit-based data flow control and a retransmission data flow control.


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