The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2024
Filed:
Mar. 25, 2022
City University of Hong Kong, Hong Kong, HK;
Jian Lu, Hong Kong, HK;
Yang Yang Li, Hong Kong, HK;
Binbin Zhou, Hong Kong, HK;
Junda Shen, Hong Kong, HK;
City University of Hong Kong, Hong Kong, HK;
Abstract
A method for microengineering a gradient structure on a metal surface. A metal surface including at least first, second, and third metal surface regions is exposed to a metal-removing agent. A portion of surface metal atoms is removed by the metal-removing agent in each of the first, second, and third metal surface regions. Sequential metal removal processes expose only the second and third regions to the metal-removing agent, followed by exposing only the third region to the metal-removing agent. A gradient metal surface is formed having different properties in each of the first, second, and third metal surface regions. In a further aspect, quantitative surface-enhanced Raman spectroscopy may be performed using the treated metal surface. An amount of an analyte is determined based on its position in one of the first, second, or third metal surface regions.