The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2024
Filed:
Apr. 06, 2020
Thermal conductive silicone composition, semiconductor device, and method for manufacturing the same
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Shota Akiba, Annaka, JP;
SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;
Abstract
A thermal conductive silicone composition contains, in specific amounts, each of (A) an organopolysiloxane containing two or more alkenyl groups bonded to a silicon atom in one molecule, (B) an organohydrogenpolysiloxane containing two or more hydrogen atoms bonded to a silicon atom in one molecule, (C) a catalyst for hydrosilylation reaction, (D) a silver powder with a tapped density of 3.0 g/cmor higher, a specific surface area of 2.0 m/g or less, and an aspect ratio of 1 to 30, and (E) a natural graphite powder or a synthetic graphite powder with an average particle size of 3 μm to 50 μm. This provides: a thermal conductive silicone composition that gives a cured material having a favorable heat-dissipating property; a semiconductor device using the cured material of the composition; and a method for manufacturing the same.