The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2024

Filed:

Dec. 04, 2019
Applicant:

Bostik SA, Colombes, FR;

Inventors:

Naji Hussein, Venette, FR;

Stéphanie Komar, Venette, FR;

Bénédicte Delory, Venette, FR;

Magali Mangeant, Venette, FR;

Assignee:

BOSTIK SA, Colombes, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 5/06 (2006.01); A61L 15/58 (2006.01); B32B 5/02 (2006.01); B32B 7/12 (2006.01); B32B 27/12 (2006.01); B32B 27/32 (2006.01); B32B 37/12 (2006.01); B32B 37/20 (2006.01); C09J 11/08 (2006.01); C09J 123/08 (2006.01); C09J 123/14 (2006.01);
U.S. Cl.
CPC ...
C09J 5/06 (2013.01); B32B 5/022 (2013.01); B32B 7/12 (2013.01); B32B 27/12 (2013.01); B32B 27/32 (2013.01); B32B 37/1207 (2013.01); B32B 37/203 (2013.01); C09J 11/08 (2013.01); C09J 123/08 (2013.01); C09J 123/142 (2013.01); A61L 15/585 (2013.01); B32B 2037/1215 (2013.01); B32B 2250/02 (2013.01); B32B 2250/246 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2262/0253 (2013.01); B32B 2305/20 (2013.01); B32B 2307/726 (2013.01); B32B 2307/732 (2013.01); B32B 2309/02 (2013.01); B32B 2323/04 (2013.01); B32B 2323/10 (2013.01); B32B 2555/02 (2013.01); C09J 2409/00 (2013.01); C09J 2423/00 (2013.01); C09J 2423/04 (2013.01); C09J 2423/10 (2013.01); C09J 2491/00 (2013.01);
Abstract

1) Hot melt adhesive composition comprising: —from 30% to 55% of a composition (A) consisting of 2 copolymers of propylene and ethylene (A1) and (A2), with Mw of less than 100,000 Da, wherein: —(A1) is an essentially amorphous copolymer, with a DSC melt enthalpy of 10 less than 30 J/g; —(A2) is a semicrystalline copolymer with a DSC melt enthalpy of more than 30 J/g; and —the ratio:weight of (A2)/weight of (A1) is from 0.2 to 1.5; —from 20% to 50% of a tackifying resin (B); and 1 —from 2% to 25% of a plasticizer (C) consisting of a liquid polybutene oligomer. 2) Process of manufacturing an assembly product, preferably a disposable nonwoven absorbent article, implementing said hot melt adhesive composition.


Find Patent Forward Citations

Loading…